round type led lamps LG3333-PF ligitek electronics co.,ltd. property of ligitek only data sheet doc. no : qw0905-LG3333-PF rev. : a date : 11 - sep. - 2005 pb lead-free parts
60 0 30 75%100% 25% 0 25%50% -30 -60 50% 75% 100% package dimensions part no. LG3333-PF note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation page 1/5 ligitek electronics co.,ltd. property of ligitek only + - 2.54typ 7.6 8.6 25.0min 1.0min 0.5 typ 1.5max 5.9 5.0
part no. LG3333-PF 565 ligitek electronics co.,ltd. property of ligitek only unit ma mw a ma g symbol absolute maximum ratings parameter absolute maximum ratings at ta=25 120 100 i fp pd 10 ir power dissipation peak forward current duty 1/10@10khz reverse current @5v forward current i f 30 page 2/5 -40 ~ +100 tstg tsol storage temperature soldering temperature forward voltage @20ma(v) color typical electrical & optical characteristics (ta=25 ) max 260 for 5 sec max (2mm from body) luminous intensity @10ma(mcd) 15020 max.min. min. 65 2.6 30 1.7 emittedlens green water clear gap LG3333-PF note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typ. peak wave length pnm spectral halfwidth nm viewing angle 2 1/2 (deg) part nomaterial operating temperature -40 ~ +85 t opr
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip fig.6 directive radiation 3/5 part no. LG3333-PF
120 260 time(sec) temp( c) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 3 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 260 c3sec max preheat 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 3 /sec max 5 /sec max 25 ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. LG3333-PF 60 seconds max
part no. LG3333-PF ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. page 5/5 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not.
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